Advanced Flip Chip Packaging

Ho-Ming Tong, Yi-Shao Lai, C.P. Wong (Herausgeber)

Buch | Hardcover

560 Seiten

2013
Springer-Verlag New York Inc.
978-1-4419-5767-2 (ISBN)

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Advanced Flip Chip Packaging presents past, present and future advances and trends in areas such as substrate technology, material development, and assembly processes. Flip chip packaging is now in widespread use in computing, communications, consumer and automotive electronics, and the demand for flip chip technology is continuing to grow in order to meet the need for products that offer better performance, are smaller, and are environmentally sustainable.

Flip Chip Technology Overview and Early Beginnings.- Technology Trends of Flip Chip.- Bumping Technologies.- Flip-Chip Interconnections: Past, Present and Future.- Underfill.- Conductive Adhesives for Flip Chip Applications.- Enabling Substrate Technologies: Past, Present and Future.- IC-Package-System Integrated Design.- Thermal Management of Flip Chip Packages.- Thermo-Mechanical Reliability in Flip Chip Packages.- Interfacial Reactions and Electromigration in Flip-Chip Solder Joints.

Erscheint lt. Verlag	21.3.2013
Zusatzinfo	VII, 560 p.
Verlagsort	New York, NY
Sprache	englisch
Maße	155 x 235 mm
Themenwelt	Technik ► Elektrotechnik / Energietechnik
Themenwelt	Technik ► Maschinenbau
ISBN-10	1-4419-5767-7 / 1441957677
ISBN-13	978-1-4419-5767-2 / 9781441957672
Zustand	Neuware