Polymers for Electronic & Photonic Application (eBook)

Front Cover 1
Polymers for Electronic and Photonic Applications 4
Copyright Page 5
Table of Contents 6
Contributors 12
Preface 14
Chapter 1. 
16 
I. Introduction 16
II. Radiation-Sensitive Resists 20
III. Polymers for Packaging Applications 56
IV. Active Polymers 68
V. Conclusions 72
References 73
Chapter 2. 
82 
I. Introduction 82
II. Resist Design Requirements 86
III. Negative Resist Chemistry 90
IV. Positive Resist Chemistry 103
V. Multilevel Resist Chemistry 116
VI. Gas-Phase Functionalization 124
VII. Conclusion 125
References 126
Chapter 3. 
134 
I. Introduction 135
II. Chemistry of Candidate Interconnect Dielectrics 137
III. Polymer Processing 148
IV. Electrical Properties 161
V. Mechanical Properties 164
VI. Chemical Properties 170
VII. Conclusions 174
Acknowledgments 174
References 175
Chapter 4. 
182 
I. Introduction 182
II. Purpose of Encapsulation 184
III. Pre-encapsulation Cleaning 187
IV. Encapsulation Process Techniques 189
V. Device Encapsulants 201
VI. Recent Advances in Hermetically Equivalent IC Packaging 224
VII. Conclusions 228
References 229
Chapter 5. 
236 
I. Introduction 236
II. Classification of Electronic Applications 237
III. Advantages of Polyimide for Electronic Applications 237
IV. Varieties of Polyimide 237
V. Required Properties of Polyimide for Electronic Applications 241
VI. Conclusion 261
References 261
Chapter 6. 
264 
I. Introduction 264
II. Chemistry and Synthetic Schemes 266
III. Structure-Property Relationships — An Overview 288
IV. Products and Applications 289
V. New Developments and Remarks 295
Acknowledgments 297
References 298
Chapter 7. 
302 
I. Introduction 302
II. Epoxy Resins 303
III. Curing Agents 307
IV. Summary 344
References 345
Chapter 8. 
348 
I. Introduction 348
II. A Brief History of Plastics in Electronics 349
III. Emerging Trends in Electronics and Their Impact on Plastics 350
IV. Application Criteria for Plastics in Electronics 352
V. New Thermoplastics and Their Properties 354
VI. Emerging Electronic Applications of Thermoplastics 378
VII. Future Trends and Needs 395
References 399
Chapter 9. 
402 
I. Introduction 402
II. Multilayer Dielectrics 403
III. Material Design Strategy 408
IV. Structure Evaluation 440
V. Strategy Summary 442
References 447
Chapter 10. 
450 
I. Introduction 450
II. Polarization in Polymers 452
III. Pyroelectric Coefficients 461
IV. Piezoelectric Coefficients 465
V. Specific Polymers 469
VI. Conclusion 475
References 476
Chapter 11. Polymers for Nonlinear Optics 482
I. Introduction 482
II. Applications Requirements 488
III. Polymers for x(2) Applications 498
IV. Organic Materials for Third-Order Nonlinear Applications 509
V. Conclusions 514
References 516
Chapter 12. 
522 
I. Introduction 522
II. Nonlinear Optics — Theory 526
III. Measuring Microscopic Elasticities with Second Harmonic Generation 540
IV. Molecular Susceptibilities 542
V. Experimental Techniques 551
VI. Electronic Response of a Disperse Red Azo Dye 555
VII. Survey of Molecular Susceptibilities 557
VIII. Future of Doped Polymers as Third-Order Materials 560
Acknowledgments 561
Appendix A 562
References 562
Chapter 13. 
564 
I. Introduction 564
II. Polymer Integrated Optics for Optical Interconnects 565
III. Waveguide Fabrication Technique Review 566
IV. Polymers for Optical Interconnects 608
Acknowledgments 609
References 612
Chapter 14. 
616 
I. Introduction 616
II. Langmuir-Blodgett Multilayers: Fabrication and Characterization 617
III. Design, Fabrication, and Properties of Electrically Conductive LB Films 631
IV. Complex Molecular Assemblies of Electroactive Polymers 637
Acknowledgments 642
References 642
Chapter 15. 
648 
I. Introduction 648
II. Concepts of Elasticity 649
III. The Concepts of Viscoelasticity 651
IV. Measurement of Viscoelastic Behavior 652
V. The Effect of Temperature and Time -Temperature Superposition 654
VI. Large Deformation Behavior 662
References 665
Index 666