Packaging of High Power Semiconductor Lasers
Springer-Verlag New York Inc.
978-1-4614-9262-7 (ISBN)
Dr. Xingsheng Liu, Dr. Wei Zhao, Dr. Lingling Xiong, and Dr. Hui Liu are at the Xi’an Institute of Optics & Precision Mechanics, Chinese Academy of Sciences.
Introduction of High Power Semiconductor Lasers.- Overview of High Power Semiconductor Laser Packages.- Thermal Design and Management in High Power Semiconductor Laser Packaging.- Thermal Stress in High Power Semiconductor Lasers.- Optical Design and Beam Shaping in High Power Semiconductor Lasers.- Materials and Components in High Power Semiconductor Laser Packaging.- Packaging Process of High Power Semiconductor Lasers.- Testing and Characterization of High Power Semiconductor Lasers.- Failure Analysis and Reliability Assessment in High Power Semiconductor Laser Packaging.- Applications of High Power Semiconductor Lasers.- Development Trend and Challenges in High Power Semiconductor Laser Packaging.
| Reihe/Serie | Micro- and Opto-Electronic Materials, Structures, and Systems |
|---|---|
| Zusatzinfo | 386 Illustrations, color; 111 Illustrations, black and white; XV, 402 p. 497 illus., 386 illus. in color. |
| Verlagsort | New York, NY |
| Sprache | englisch |
| Maße | 155 x 235 mm |
| Themenwelt | Technik ► Elektrotechnik / Energietechnik |
| Schlagworte | fiber lasers • High Power Semiconductor Lasers • Semiconductor Laser Components • Semiconductor Laser Packaging • Semiconductor Lasers • Solid state lasers • Thermal Stress Modeling |
| ISBN-10 | 1-4614-9262-9 / 1461492629 |
| ISBN-13 | 978-1-4614-9262-7 / 9781461492627 |
| Zustand | Neuware |
| Haben Sie eine Frage zum Produkt? |
aus dem Bereich
