Three-Dimensional Integrated Circuit Layout
Seiten
2009
Cambridge University Press (Verlag)
978-0-521-11816-3 (ISBN)
Cambridge University Press (Verlag)
978-0-521-11816-3 (ISBN)
First published in 1991, this thesis concentrates upon the design of three-dimensional, rather than the traditional two-dimensional, circuits. The theory behind such circuits is presented in detail, together with experimental results. Winner of the Distinguished Dissertation in Computer Science award, this work will prove invaluable to both designers and hardware engineers involved in the development of practical three-dimensional integrated circuits.
Introduction; 1. Two-dimensional chip design; 2. Three-dimensional chip technology; 3. Three-dimensional circuit topology; 4. Three-dimensional cell tesselation; 5. Three-dimensional abutment system; 6. Abutment system configuration; 7. Abutment system evaluation; Conclusions; Appendices; Index.
Erscheint lt. Verlag | 6.8.2009 |
---|---|
Reihe/Serie | Distinguished Dissertations in Computer Science |
Zusatzinfo | Worked examples or Exercises |
Verlagsort | Cambridge |
Sprache | englisch |
Maße | 170 x 244 mm |
Gewicht | 390 g |
Themenwelt | Mathematik / Informatik ► Informatik ► Theorie / Studium |
Technik ► Elektrotechnik / Energietechnik | |
ISBN-10 | 0-521-11816-6 / 0521118166 |
ISBN-13 | 978-0-521-11816-3 / 9780521118163 |
Zustand | Neuware |
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