Foldable Flex and Thinned Silicon Multichip Packaging Technology
Springer-Verlag New York Inc.
978-1-4613-4977-8 (ISBN)
1. 3-D Assemblies of Stacked Chips and other Thin Packages.- 2. Multi-Chip Carriers in a System-on-a-Chip World.- 3. Packaging Technologies for Flexible Systems.- 4. Low Profile and Flexible Electronic Assemblies Using Ultra-Thin Silicon - The European Flex-Si Project.- 5. Thin Chips for Flexible and 3-D Integrated Electronic Systems.- 6. Flexible Microarray Interconnection Techniques Applied to Biomedical Microdevices.- 7. Folded Flex and other Structures for System-in-a Package.- 8. Valtronic CSP3D Technology.- 9. 3-D Packaging Technologies: Are Flex based Solutions the Answer?.- 10. Availability of High Density Interconnect Flexible Circuits.- 11. Recent Advances in Flexible Circuit Technology Using Liquid Crystal Polymer Substrates.- 12. Flex and the Interconnected Mesh Power System (IMPS).- 13. Thermal Management and Control of Electromagnetic Emissions.- Conclusions.- Authors’ Biographies.
Reihe/Serie | Emerging Technology in Advanced Packaging ; 1 |
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Zusatzinfo | 266 Illustrations, black and white; XIX, 347 p. 266 illus. |
Verlagsort | New York, NY |
Sprache | englisch |
Maße | 155 x 235 mm |
Themenwelt | Naturwissenschaften ► Chemie ► Physikalische Chemie |
Technik ► Elektrotechnik / Energietechnik | |
Technik ► Maschinenbau | |
ISBN-10 | 1-4613-4977-X / 146134977X |
ISBN-13 | 978-1-4613-4977-8 / 9781461349778 |
Zustand | Neuware |
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