RF Measurements of Die and Packages
Seiten
2002
Artech House Publishers (Verlag)
978-1-58053-273-0 (ISBN)
Artech House Publishers (Verlag)
978-1-58053-273-0 (ISBN)
This text explains how to perform high-accuracy RF measurements of die and packages in the RF test lab. It defines the essential elements in an RF system, explains where errors can be found in such a system and shows how to mathematically remove them with calibration.
This text is dedicated to the issues surrounding RFIC (radio-frequency integrated circuit) testing. It explains how to perform high-accuracy RF measurements of die and packages in the RF test lab. It defines the essential elements in an RF system, explains where errors can be found in such a system and shows how to mathematically remove them with calibration. This book should be of interest to: RFIC designers and high-frequency digital IC designers, IC test engineers and IC manufacturing test engineers.
This text is dedicated to the issues surrounding RFIC (radio-frequency integrated circuit) testing. It explains how to perform high-accuracy RF measurements of die and packages in the RF test lab. It defines the essential elements in an RF system, explains where errors can be found in such a system and shows how to mathematically remove them with calibration. This book should be of interest to: RFIC designers and high-frequency digital IC designers, IC test engineers and IC manufacturing test engineers.
Preface. Introduction, Calibration, Coplanar Probes. High-Volume Probing. Test Fixtures. On-Wafer Characterization. RF Test Systems. Package Characterization. Future Trends. Appendix.
Erscheint lt. Verlag | 31.5.2002 |
---|---|
Reihe/Serie | Microwave Library |
Zusatzinfo | black & white illustrations |
Verlagsort | Norwood |
Sprache | englisch |
Maße | 156 x 234 mm |
Gewicht | 520 g |
Themenwelt | Technik ► Elektrotechnik / Energietechnik |
ISBN-10 | 1-58053-273-X / 158053273X |
ISBN-13 | 978-1-58053-273-0 / 9781580532730 |
Zustand | Neuware |
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