Multichip Modules with Integrated Sensors

Preface.- Reliability Effects for MCM and Sensors.- “Thermal Investigations of Microsystems,”.- “Failure Analysis of Migrated Short Circuits in MCMs Using Soldering,”.- “Internal Liquid Cooling of Integrated Circuits and Multichip Modules,”.- “Holographic and Thermal Diagnostics of Integrated Circuits,”.- “Accelerated Life Tests of Ultrasonic Wire Bonds,”.- “The Methods of Improving Radiation Resistance of Hybrid Integral Circuits Elements,”.- “Wire Bonding to Multichip Modules and Other Soft Substrates,”.- MCM-C.- “MCMs for Computers and Telecom in CHIPPAC Programme,”.- “Buried Passive Component Realization in Low Temperature Cofired Ceramic for MCM-C Substrate Applications,”.- “A Novel Transcutaneous Blood oxygen Sensor Based on MCM-C Technology,”.- “Advanced Thick Film Techniques for Multilayer Structures and Sensors,”.- MCM-D/L.- “Some Investigations on Wiring in New Generation Multichip Modules Applied in High Speed Large Scale Integrated Telecommunication Units,”.- “Some Chapters from the COB Technology,”.- “Thin Film Multichip Modules Based on Photosensitive Benzocyclobutene,”.- Sensors.- “Thin Film Thermal Microsensors,”.- “Electrical Properties of Thick Film PTC Composition”.- “Current Research on Thin and Thick Film Sensors at the Department of Electronics, University of Mining and Metallurgy in Krakow,”.- “Materials and Devices for Fiber Optic Sensors,”.- “Integration Techniques for Smart Sensors,”.- “Micro-Machined Accelerometers for MCM Integration,”.- “Research into Novel Sensors on Silicon Substrates,”.- System Requirements and Integration.- “From Multichip Modules (MCMs) to Micro System Modules (MSMs),”.- “Prototyping of Multichip Modules - Theory, Services, andAssessment,”.- “BARMINT Project for Promoting Standards in Microsystem Integration,”.- “A Hybrid Integrated Gassensor on Silicon,”.- ISHM-Hungary Poster Papers.- “Investigation of Ultraviolet Laser Induced Conductive Layer of Silver Salt Filled Polyimide Films,”.- “57Fe and 57Co Mössbauer Study of Suppression of Superconductivity in PrBa2Cu307-d,”.- “Plastic PGA-64 Packages,”.- “Analysis of Laser Induced Surface Effects on A£N Substrates,”.- “Structural and Electrical Characterization of AIGeNi/n-GaAs Contacts,”.- “Buried Vias in Multilayer Printed Wiring Boards,”.- “Surface Pattern Formation and the Volatile Component Loss of Heat Treated Pd/InP and Au/InP Samples,”.- “Polymer Thick-Film Pressure Sensor,”.- Author Index.- Keyword Index.